This week we’re excited to introduce BMF TOUGH, the newest member of the BMF resin portfolio. Compatible with all microArch systems, this photocurable resin boasts excellent toughness, great printability, and the capacity to produce end-use parts. Since BMF’s founding 4 years ago, we have worked to continuously improve our material offerings and TOUGH is the latest reflection of that. In the past, BMF customers have used the microArch platform primarily for prototyping applications, and our material portfolio has supported that. Now, more and more BMF customers are moving towards production applications using the microArch platform, and TOUGH meets that growing demand.
Introducing BMF TOUGH
